SIPLACE CAV2-G3-SWS

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Description

Integrate high-growth technologies of the future such as flip chips and die attach into your SMT production with the SIPLACE CA, the world’s first platform that lets you flexibly combine the placement of bare dies directly from the wafer with classic feeder-based SMT placement.

Placement Solutions, SIPLACE CA

Bestückungslösungen, SIPLACE CA

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ASM machine single without operator